Processing method and processing apparatus using interfered laser beams
AssigneeCanon Kabushiki Kaisha
InventorHideo Iwase
Life of this patent
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Abstract
Provided are a processing method and a processing apparatus which are capable of suppressing a disturbance attributable to a surface wave in a processing by interfered laser beams, in particular, a processing by the interfered laser beams of a pulsed laser having a pulse width of equal to or more than 1 fs and of equal to or less than 1 ps, in which the wavelength of a surface wave that propagates in a direction of the interference of the laser is made longer than a pitch of the interference of the laser on a surface of an object to be processed to process the object.
Claims4
1-12. (canceled)
A processing apparatus having a pulsed laser of which a laser beam is divided into plural laser beams which are caused to interfere with each other at an interference point on a surface of an object, the processing apparatus comprising:
- a wavelength plate configured to adjust a polarization of the laser beam such that a direction of polarization of the laser beam is orthogonal to a direction of interference, the wavelength plate being located on, respective optical paths of the divided laser beams extending toward the interference point,
- wherein the divided laser beams adjusted by the wavelength plate are caused to interfere with each other to process the object.
Dependencies are inferred from the claim text.