Method for forming electrode pattern of ceramic substrate
AssigneeSamsung Electro-Mechanics Co., Ltd.
InventorsWon Hee Yoo, Byeung Gyu Chang, Yong Suk Kim
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Abstract
The present invention relates to a method for forming electrode patterns of a ceramic substrate including the steps of: forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another; forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate; forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer; forming a plating layer on the plating seed layer exposed by the photoresist patterns; removing the photoresist patterns; and etching parts of the plating seed layer exposed by removal of the photoresist patterns.
Claims8
A method for forming electrode patterns of a ceramic substrate comprising:
- forming a plurality of conductive adhesion patterns on the ceramic substrate to be separated apart from one another;
- forming a plating seed layer, covering the conductive adhesion patterns, on the ceramic substrate;
- forming photoresist patterns, exposing parts corresponding to the conductive adhesion patterns, on the plating seed layer;
- forming a plating layer on the plating seed layer exposed by the photoresist patterns;
- removing the photoresist patterns;
- and
- etching parts of the plating seed layer exposed by removal of the photoresist patterns.
Dependencies are inferred from the claim text.