Composite multi-layer substrate and module using the substrate

A composite multi-layer substrate comprising:

• a flat plate-like core member formed of a material having excellent electric conductivity, heat conductivity and high rigidity properties;
• a front side resin layer covering a front surface of said core member;
• a rear side resin layer covering a rear surface of said core member;
• a bottomless hole formed in said core member penetrating a front and rear of said core member;
• an electronic component mounted in said bottomless hole, the thickness of the electronic component after mounting in said bottomless hole at least does not cross the upper surface height position of said core member;
• a small hole formed in either one or both of said front side resin layer and said rear side resin layer located directly above or directly below the electronic component and extends in a vertical direction of the front surface and the rear surface of said core member;
• and
• an electrode formed on an interior portion of said small hole;
• wherein an electrical connection to the electronic component is provided via the electrode.

A composite multi-layer substrate comprising:

• a flat plate-like core member formed of a material having excellent electric conductivity, heat conductivity and high rigidity properties;
• a front side resin layer covering a front surface of said core member;
• a rear side resin layer covering a rear surface of said core member;
• a bottomless hole formed in said core member and said rear side resin layer penetrating a front and rear of said core member and a front and rear of said rear side resin layer;
• an electronic component mounted in said bottomless hole, the thickness of the electronic component height size being lower than a depth size of said core member;
• and
• a height size adjustment member having excellent heat conductivity interposed among said electronic component and said core member and said rear side resin layer, wherein a rear side surface of the height size adjustment member and the rear side resin layer form a flat surface;
• wherein said height size adjustment member is interposed between the bottom of said electronic component when said electronic component height size is lower than the depth size of said core member mounted in said bottomless hole, wherein said height size adjustment member is adapted to adjusting a height of said electronic component.

A composite multi-layer substrate comprising:

• a flat plate-like core member formed of a material having excellent electric conductivity, heat conductivity and high rigidity properties;
• a front side resin layer covering a front surface of said core member;
• a rear side resin layer covering a rear surface of said core member;
• a bottomless hole formed in said core member and said rear side resin layer penetrating a front and rear of said core member and a front and rear of said rear side resin layer;
• an electronic component mounted in said bottomless hole, the thickness of the electronic component height size being lower than a depth of said core member;
• and
• a height size adjustment member interposed among said electronic component and said core member and said rear side resin layer;
• wherein said core member is a subtractively patterned core member.

A composite multi-layer substrate comprising:

• a flat plate-like core member formed of a material having excellent electric conductivity, heat conductivity and high rigidity properties;
• a front side resin layer covering a front surface of said core member;
• a rear side resin layer covering a rear surface of said core member;
• a flat bottomed hole formed in an opening of either one of said front surface of said core member or said rear surface of said core member;
• and
• an electronic component mounted in said flat bottomed hole, the thickness of the electronic component after mounting in said flat bottomed hole at least does not cross the upper surface height position of said core member;
• a small hole formed in either one or both of said front side resin layer and said rear side resin layer located directly above or directly below the electronic component and extends in a vertical direction of the front surface and the rear surface of said core member;
• and
• an electrode formed on an interior portion of said small hole;
• wherein an electrical connection to the electronic component is provided via the electrode.