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AssigneeNgk Spark Plug Co., Ltd.
InventorsSeiji ICHIYANAGI, Kenji Murakami, Motohiko Sato, Jun Otsuka
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A method for manufacturing a ceramic capacitor embedded in a wiring substrate, the ceramic capacitor including a capacitor body which has a pair of capacitor main surfaces and a plurality of capacitor side surfaces also has a structure in which a plurality of internal electrodes are alternately layered through a ceramic dielectric layer, the method has (a) laminating ceramic-made green sheets and combining the green sheets into one, to form a multi-device-forming multilayer unit in which a plurality of product areas, each of which becomes the ceramic capacitor, are arranged in longitudinal and lateral directions along a plane direction, (b) forming a groove portion to form a chamfer portion at a boundary portion between at least one of the capacitor main surfaces and the plurality of capacitor side surfaces, (c) sintering the multi-device-forming multilayer unit, and (d) dividing the product areas into each product area along the groove portion.
A method for manufacturing a ceramic capacitor embedded in a wiring substrate with a resin insulation material being contiguous with an outer surface of the ceramic capacitor, wherein the ceramic capacitor includes a plate-shaped capacitor body having a pair of capacitor main surfaces which are positioned on opposite sides to each other in a thickness direction and a plurality of capacitor side surfaces and having a structure in which a plurality of internal electrodes are alternately layered through a ceramic dielectric layer, the method comprising:
A method for manufacturing a ceramic capacitor embedded in a wiring substrate with a resin insulation material being contiguous with an outer surface of the ceramic capacitor, wherein the ceramic capacitor includes a plate-shaped capacitor body having a pair of capacitor main surfaces which are positioned on opposite sides to each other in a thickness direction and a plurality of capacitor side surfaces and having a structure in which a plurality of internal electrodes are alternately layered through ceramic dielectric layers, the capacitor body has a first dielectric multilayer section in which the plurality of ceramic dielectric layers and the plurality of internal electrodes are alternately layered and a second dielectric multilayer section that is provided so as to be exposed at least one of the pair of capacitor main surfaces, and a chamfer portion is formed at a boundary portion between at least one of the capacitor main surfaces and the plurality of capacitor side surfaces, the method comprising:
Dependencies are inferred from the claim text.