US 2010/0300259 A1 · SUBSTRATE SIDE MARKING AND IDENTIFICATION

Abstract

Embodiments of the present invention provide an accurate method for marking substrates for individual substrate identification and tracking during a solar cell fabrication process. In one embodiment, each crystalline silicon ingot is marked on at least two sides via a scribing technique. In one embodiment, each crystalline silicon ingot is marked on three sides via a scribing technique. The ingots are then sliced into individual substrates, which retain the clearly visible and robust markings on the sides of the substrate. In one embodiment, the markings are detected by images captured by a moderate resolution camera at desired locations through a solar cell production line. In one embodiment, the markings are manually readable at one or more desired points throughout the solar cell production process. In general, the combination of markings uniquely identifies each individual substrate, the ingot from which the substrate was sliced, and the location within the ingot from which the substrate was obtained.

Claims20

Dependent claims

A method for substrate marking and identification, comprising:

scribing a plurality of lines on a first side of an ingot;
scribing a plurality of lines on a second side of the ingot;
and
slicing the ingot into a plurality of substrates, wherein each of the substrates has a first set of marks on a first edge corresponding to the plurality of lines scribed on the first side of the ingot, and wherein each of the substrates has a second set of marks on a second edge corresponding to the plurality of lines scribed on the second side of the ingot.

1 more element

Dependencies are inferred from the claim text.

Substrate side marking and identification

Life of this patent

Substrate side marking and identification

Life of this patent

Abstract

Claims20