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US 2010/0299919 A1Published application
Method for making a positive temperature coefficient device
AssigneeFuzetec Technology Co., Ltd.
InventorsJack Jih-Sang CHEN, Chi-Hao GU
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Abstract
A method for making a positive temperature coefficient device includes: (a) forming a crosslinkable preform of a positive temperature coefficient polymer composition containing a polymer system and a conductive filler; (b) attaching a pair of electrodes to the preform; (c) soldering a pair of conductive leads to the electrodes using a lead-free solder paste having a melting point greater than 210° C.; and (d) crosslinking the crosslinkable preform after step (c).
Claims10
A method for making a positive temperature coefficient device, comprising:
- (a) forming a crosslinkable preform of a positive temperature coefficient polymer composition containing a polymer system and a conductive filler;
- (b) attaching a pair of electrodes to the crosslinkable preform;
- (c) soldering a pair of conductive leads to the electrodes using a lead-free solder paste having a melting point greater than 210° C.;
- and
- (d) crosslinking the crosslinkable preform after step (c).
2 more elements
Dependencies are inferred from the claim text.