Components packaging system
AssigneePanasonic Corporation
InventorTsutomu Hiraki
Life of this patent
Estimating the term…
Abstract
A tools holding member 63 which holds replacement tools 23a, 34a, 44a for a pick-up head 22, a mounting head 33 and a stamping head 44 which are provided so as to move freely in a Y-axis direction in which a components supply stage 3 and a substrate holding stage 4 are aligned is provided on an overlapping area R of a moving area R1 over which the pick-up head 22 can move, a moving area R2 over which the mounting head 33 can move and a moving area R3 over which the stamping head 43 can move which lies on a moving table 15 which is provided in an area R0 lying between the components supply stage 3 and the substrate holding stage 4 so as to move freely in an X-axis direction which is at right angles to a Y-axis.
Claims4
A components packaging system, comprising:
- a component supply portion supplying components;
- a substrate holding portion holding a substrate;
- a stamping head provided movably in a first direction which is horizontal and in which the components supply portion and the substrate holding portion are aligned for stamping a paste on to a substrate held on the substrate holding portion by use of a stamping tool;
- a pick-up head provided movably in the first direction for picking up a component supplied by the components supply portion by a pick-up tool;
- a mounting head provided movably in the first direction for receiving the component picked up by the pick-up head by a mounting tool so as to mount the component on the substrate on to which the paste has been stamped by the stamping head;
- and
- tools holding member holding replacement tools for the pick-up tool, the mounting tool and the stamping tool;
- wherein a movable table movable in a second direction which is horizontal and which is at right angles to the first direction is provided in an area lying between the components supply portion and the substrate holding portion;
- and
- wherein the tools holding member is provided in an area on the movable table where a moving area over which the pick-up head can move, a moving area over which the mounting head can move and a moving area over which the stamping head can move overlap.
A components packaging method in a components packaging system comprising a stamping head which is provided so as to move freely on a guide provided along a first direction which is horizontal and in which a components supply portion for supplying a component and a substrate holding portion for holding a substrate are aligned and which stamps a paste on to a substrate held at the substrate holding portion by use of a stamping tool, a pick-up head which is provided so as to move freely on the guide and which picks up a components supplied by the components supply portion by use of a pick-up tool, a mounting head which is provided so as to move freely on the guide and which receives the component picked up by the pick-up head by use of a mounting tool to mount the component so received on the substrate on to which the paste has been stamped by the stamping head, and a tools holding member which is provided on an overlapping area of moving areas over which the pick-up head, the mounting head and the stamping head can move, respectively, between the components supply portion and the substrate holding portion and which holds replacement tools for the pick-up tool, the mounting tool and the stamping tool on a moving table which can move freely in a second direction which is horizontal and which is at right angles to the first direction, the method for packaging the component in a predetermined position on the substrate comprising the steps of:
- disposing the replacement pick-up tool, the replacement mounting tool and the replacement stamping tool on the tools holding member so that an order in which the respective replacement tools are arranged becomes the same as an order in which the pick-up head, the mounting head and the stamping head are aligned;
- replacing the pick-up tool with the replacement pick-up tool;
- picking up the component with the replacement pick-up tool;
- replacing the mounting tool with the replacement mounting tool;
- receiving the component picked up with the replacement mounting tool;
- replacing the stamping tool with the replacement stamping tool;
- and
- stamping a paste on to a substrate held on the substrate holding portion with the replacement stamping tool.
Dependencies are inferred from the claim text.