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US 2010/0290190 A1Published application
Cooled electronic system
AssigneeIceotope Limited
InventorsDaniel Chester, Peter Hopton, Jason Bent, Keith Deakin
Life of this patent
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Abstract
A sealable module, cooled electronic system and method are described relating to cooling a heat generating electronic device. The sealable module is adapted to be filled with a first cooling liquid and a heat transfer device having a conduction surface defines a channel for receiving a second cooling liquid. In one embodiment, at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component. Control of the second cooling liquid is also described. Transferring heat between the second cooling liquid and a third cooling liquid features in embodiments. A method of filling a container with a cooling liquid is further detailed.
Claims91
A sealable module for containing one or more heat generating electronic components, the module comprising:
- a housing;
- a heat transfer device having a conduction surface, the housing and the conduction surface together defining a volume in which a first cooling liquid can be located, the heat transfer device further defining a channel for receiving a second cooling liquid, the conduction surface separating the volume and the channel to allow conduction of heat between the volume and the channel through the conduction surface;
- and
- an electronic component located in the volume;
- and
- wherein at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component.
3 more elements
A sealable module kit, comprising:
- a housing;
- a heat transfer device having a conduction surface, the heat transfer device being configured to couple to the housing such that the conduction surface and housing define a volume in which a first cooling liquid can be located, the heat transfer device further defining a channel for receiving a second cooling liquid such that when the heat transfer device is coupled to the housing, the conduction surface separates the volume and the channel to allow conduction of heat between the volume and the channel through the conduction surface;
- and
- an electronic component for location in the volume;
- and
- wherein at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component.
3 more elements
A method of cooling an electronic component, comprising:
- providing a module comprising a housing and a heat transfer device having a conduction surface, the housing and the conduction surface together defining a volume;
- housing the electronic component within the volume;
- filling the volume with a first cooling liquid;
- and
- conducting heat between the first cooling liquid and a second cooling liquid through the conduction surface, the first cooling liquid and second cooling liquid being located on either side of the conduction surface;
- and
- wherein at least a portion of the conduction surface or housing is shaped in conformity with the shape of the electronic component.
4 more elements
A method of cooling an electronic device, comprising:
- providing a module comprising a housing and a first heat transfer device having a conduction surface, the housing and the conduction surface together defining a volume, the volume being filled with a first cooling liquid and having the electronic device located therein;
- operating the electronic device within the volume;
- transferring heat generated by the electronic device from the first cooling liquid to a second cooling liquid through at least a portion of the conduction surface;
- transferring heat from the second cooling liquid to a heat sink using a second heat transfer device;
- and
- setting one or both of:
- the flow rate of the second cooling liquid across the conduction surface;
- and the portion of the conduction surface through which heat is transferred to the second cooling liquid, such that the temperature of the electronic device is controlled so as not to exceed a predetermined maximum operating temperature.
5 more elements
A cooled electronic system, comprising:
- a sealed container comprising:
- a housing;
- an electronic device;
- and a first cooling liquid;
- a first heat transfer device defining a first channel for receiving a second cooling liquid, the first heat transfer device being configured to transfer heat between the first cooling liquid and the first channel through at least a portion of a conduction surface;
- and
- a piping arrangement, configured to transfer the second cooling liquid to and from the first heat transfer device;
- and
- wherein the system is configured to set one or both of:
- the flow rate of the second cooling liquid through the first channel;
- and the portion of the conduction surface through which heat is transferred to the second cooling liquid, such that the temperature of the electronic device is controlled so as not to exceed a predetermined maximum operating temperature.
8 more elements
A method of cooling an electronic device, comprising:
- operating the electronic device within a container, the container also comprising a first cooling liquid, such that heat generated by the electronic device is transferred to the first cooling liquid, the container being sealed to prevent leakage of the first cooling liquid;
- transferring heat between the first cooling liquid and a second cooling liquid in a first heat transfer device;
- piping the second cooling liquid from the first heat transfer device to a second heat transfer device;
- and
- transferring heat between the second cooling liquid and a third cooling liquid in the second heat transfer device;
- and
- piping the third cooling liquid to a heat sink.
4 more elements
A method of cooling an electronic device, comprising:
- operating the electronic device within a container, the container also comprising a first cooling liquid, such that heat generated by the electronic device is transferred to the first cooling liquid, the container being sealed to prevent leakage of the first cooling liquid;
- transferring heat between the first cooling liquid and a second cooling liquid in a first heat transfer device;
- transferring heat between the second cooling liquid and a heat sink;
- and
- controlling the heat transfer rate between the second cooling liquid and the heat sink, such that the temperature of the electronic device does not exceed a predetermined maximum operating temperature and such that, during a first time period, the heat transfer rate does not go above a predetermined maximum rate, and such that during a second, later time period, the heat transfer rate may go above the predetermined maximum rate.
2 more elements
A cooled electronic system, comprising:
- a sealed container comprising:
- a housing;
- an electronic device;
- and a first cooling liquid;
- a first heat transfer device defining a first channel for receiving a second cooling liquid, the first heat transfer device being configured to transfer heat between the first cooling liquid and the first channel;
- and
- a second heat transfer device comprising a second channel for receiving the second cooling liquid from the first channel, and a third channel for receiving a third cooling liquid for coupling to a heat sink, the second heat transfer device being configured to transfer heat between the second channel and the third channel.
4 more elements
A method of filling the interior a container for an electronic device with a cooling liquid, the method comprising:
- adapting the container to receive the cooling liquid by at least one of:
- heating the container to a filling temperature;
- and reducing the pressure in the interior of the container;
- filling the container with the cooling liquid;
- and
- sealing the container to prevent leakage of the cooling liquid.
3 more elements
A method of filling the interior a container for an electronic device with a cooling liquid, the method comprising:
- heating the cooling liquid to a filling temperature;
- filling the container with the heating cooling liquid;
- sealing the container to prevent leakage of the cooling liquid;
- and
- cooling the sealed container and cooling liquid to an operating temperature.
2 more elements
Dependencies are inferred from the claim text.