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AssigneeNippon Steel Chemical Co., Ltd.
InventorsAtsuhiko Katayama, Keiji Banno, Niranja Kumar Shrestha, Toshihide Senzaki
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Disclosed is a water-soluble, thermally polymerizable oxetane composition essentially comprising a water-soluble oxetane compound and a heteropolyacid. The water-soluble thermally polymerizable oxetane resin composition essentially comprises (A) a water-soluble oxetane compound and (B) at least one heteropolyacid compound selected from heteropolyacids and heteropolyacid salts. The water-soluble oxetane compound may contain one or more oxetane functional groups in the molecule and one or more alcoholic OH groups in the molecule. The heteropolyacids include phosphotungstic acid, phosphomolybdic acid, silicotungstic acid, and silicomolybdic acid and mixtures thereof. The heteropolyacid salts include phosphotungstic acid salts, phosphomolybdic acid salts, silicotungstic acid salts, and silicomolybdic acid salts and mixtures thereof.
A thermally polymerizable resin composition comprising (A) a water-soluble oxetane compound, (B) a heteropolyacid compound, and (C) an aqueous medium wherein the water-soluble oxetane compound contains one or more oxetane functional groups represented by the following general formula (1) in the molecule and one or more alcoholic OH groups in the molecule, the heteropolyacid compound is at least one selected from heteropolyacids and heteropolyacid salts, and the composition is a solution in the aqueous medium;
7-9. (canceled)
Dependencies are inferred from the claim text.