Latent curing agents, epoxy resin compositions containing the same, sealing materials, and organic el displays
AssigneeMitsui Chemicals, Inc.
InventorsHiroaki Tamatani, Mitsuaki Chida, Yugo Yamamoto, Yuichi Ito, Takashi Nakano, Naritoshi Yoshimura
Life of this patent
Estimating the term…
Abstract
The invention aims to provide latent curing agents which exert high low-temperature curing properties when used together with ionically polymerizable compounds and which exhibit high storage stability at room temperature. Latent curing agents for ionically polymerizable compounds which agents each contain a hydroxyl-free amine imide compound having an N—N bond energy of 100 to 210 kJ/mol as determined by B3LYP functional theory method.
Claims15
A latent curing agent for curing ionically polymerizable compounds comprising:
- a hydroxyl-free amine imide,
- wherein the hydroxyl-free amine imide has an N—N bond energy of 100 to 210 kJ/mol as determined by the B3LYP density functional method.
An amine imide having the following general formula (2):
- where R6 denotes aryl or aryloxy group which optionally has a substituent other than hydroxyl group;
- R7 and R8 independently denote an alkyl or aryl group which optionally has a substituent other than hydroxyl group, or are joined together to form a hydroxyl-free ring;
- R9 denotes an organic group other than hydroxyl group;
- and R10 denotes an alkyl, aryl, aminocarbonyl, acyl or oxycarbonyl group which optionally has a substituent other than hydroxyl group;
- and none of R6 to R10 has groups reactive with epoxy group.
Dependencies are inferred from the claim text.