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US 2010/0252804 A1Published application
Cathode assembly containing an ultraviolet light-blocking dielectric layer
AssigneeE.I. du Pont de Nemours and Company
InventorsLap-Tak Andrew Cheng, Adam Fennimore
Life of this patent
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Abstract
A field emission cathode assembly that has a UV-blocking, insulating dielectric layer (3.4).
Claims15
A cathode assembly apparatus comprising:
- a) a cathode electrode disposed on a substrate,
- b) a UV-blocking, insulating dielectric disposed on the cathode electrode,
- c) a gate electrode disposed on the dielectric,
- d) a plurality of vias through the gate electrode and dielectric that expose the cathode electrode, and
- e) an electron field emitter located in the vias.
2 more elements
A method of fabricating a cathode assembly comprising:
- a) coating a substrate with a first layer of conductive material,
- b) depositing a UV-blocking, insulating dielectric on the first layer of conductive material,
- c) depositing a second layer of conductive material on the dielectric,
- d) forming one or more vias through the second layer of conductive material and the dielectric to expose the first layer of conductive material, and
- e) depositing an electron emitting material in the via(s).
2 more elements
A method of fabricating a cathode assembly comprising
- a) coating a first side of a UV-transparent substrate with a layer of a UV-transparent conductive material,
- b) depositing a UV-blocking, insulating dielectric on the conductive layer,
- c) depositing a top layer of conductive material on the dielectric,
- d) forming one or more vias through the top layer of conductive material and the dielectric to expose the layer of UV-transparent conductive material,
- e) depositing photoresist material on the top layer of conductive material and in the via(s),
- f) irradiating the photoresist material through the substrate,
- g) developing the photoresist material to form a channel in each via and re-expose the layer of UV-transparent conductive material,
- h) depositing photoimageable electron emitting material on the photoresist material and in the channel(s) of the via(s),
- i) irradiating the emitting material through the substrate, and
- j) removing the photoresist material and uncured emitting material.
7 more elements
Dependencies are inferred from the claim text.