Semiconductor substrate wiring design support device and control method thereof
AssigneeFujitsu Limited
InventorKoichi NAKAGAWA
Life of this patent
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AssigneeFujitsu Limited
InventorKoichi NAKAGAWA
Estimating the term…
A semiconductor substrate wiring design support device includes a memory unit that stores logical connection information and a wiring unit that performs wiring based on the logical connection information and provides a single via between a first and a second wire layer when the wiring is a wire between the first and the second wire layer. An isolated-via-error detection unit detects the single via as an isolated-via-error when only the single via is provided in a case where a plurality of vias may be needed according to a via alteration rule. An isolated-via-error-treatment via alteration unit alters a single via detected as the isolated-via-error to an isolated-via-error-treatment via, and a redundancy via alteration unit alters a single via to a redundancy via after the alteration to the isolated-via-error-treatment via.
A semiconductor substrate wiring design support device for supporting a wiring design of a semiconductor substrate, the semiconductor substrate wiring design support device comprising:
A method of controlling a semiconductor substrate wiring design support device that includes a memory unit storing logical connection information, the method comprising:
A computer readable recording medium that stores a program for controlling a semiconductor substrate wiring design support device that includes a memory unit storing logical connection information and an arithmetic processing unit, the computer readable recording medium causing the arithmetic processing unit to execute operations comprising:
Dependencies are inferred from the claim text.