Method for quantifying hole flow rates in film cooled parts
AssigneeGeneral Electric Company
InventorsRonald Scott Bunker, Jason Randolph Allen
Life of this patent
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Abstract
A method for measuring a flow rate through a cooling hole of a film cooled part includes the steps of 1) measuring a transient thermal response of an internal surface temperature corresponding solely to an inside portion of a cooling hole for a film cooled part resulting from a flow of fluid through the part, the fluid having an initial temperature that is different from an initial temperature of the film cooled part, 2) mathematically characterizing the transient thermal response, and 3) determining the cooling hole flow rate from the mathematical characterization.
Claims21
A method for measuring a flow rate through a cooling hole of a film cooled part, the method comprising:
- measuring a transient thermal response of an internal surface temperature corresponding solely to an inside portion of a cooling hole for a film cooled part resulting from a flow of fluid through the part, the fluid having an initial temperature that is different from an initial temperature of the film cooled part;
- mathematically characterizing the transient thermal response;
- and
- determining the cooling hole flow rate from the characterization.
A method for measuring a flow rate through a cooling hole of a film cooled part, the method comprising:
- measuring a transient thermal response of an internal surface temperature corresponding solely to an inside portion of a cooling hole for a film cooled part resulting from a flow of fluid through the part, the fluid having an initial temperature that is different from an initial temperature of the film cooled part;
- mathematically characterizing the transient thermal response;
- and
- determining a desired thermal response characteristic from the mathematical characterization.
Dependencies are inferred from the claim text.