Ultrasound probe with replaceable head portion

A transducer stack assembly for an ultrasound probe, the transducer stack assembly, comprising:

• at least one acoustic matching layer;
• a dematching layer;
• a piezoelectric transducer layer disposed between the at least one acoustic matching layer and the dematching layer;
• an interposer layer;
• wherein the dematching layer is disposed on the interposer layer;
• an integrated circuit comprising a plurality of conductive bumps, wherein the interposer layer is disposed between the dematching layer and the integrated circuit.

A transducer stack assembly for an ultrasound probe, the transducer stack assembly, comprising:

• at least one acoustic matching layer;
• a dematching layer;
• a piezoelectric transducer layer disposed between the at least one acoustic matching layer and the dematching layer;
• a substrate provided with conductive bumps, wherein the dematching layer is disposed on the substrate provided with conductive bumps.

A method of manufacturing a transducer stack assembly for an ultrasound probe, the method comprising:

• providing at least one acoustic matching layer;
• providing a dematching layer;
• disposing a piezoelectric transducer layer between the at least one acoustic matching layer and the dematching layer;
• and
• disposing an interposer layer between the dematching layer and an integrated circuit;
• wherein an integrated circuit comprises a plurality of conductive bumps.

A method of manufacturing a transducer stack assembly for an ultrasound probe, the method comprising:

• providing at least one acoustic matching layer;
• disposing a piezoelectric transducer layer disposed between the at least one acoustic matching layer and a dematching layer;
• and
• disposing the dematching layer on the substrate provided with conductive bumps.