Back to results
US 2010/0249279 A1Published application
Thermally curable resin composition and cured product thereof
AssigneeTaiyo Ink Mfg. Co., Ltd.
InventorsYuta OGAWA, Shinichiro Fukuda, Katsuto Murata
Life of this patent
Estimating the term…
Abstract
A thermally curable resin composition includes a linear thermally curable resin and amorphous silica fine particles having pore portions.
Claims17
A thermally curable resin composition comprising:
- a linear thermally curable resin;
- and
- amorphous silica fine particles having pore portions.
A cured product of a thermally curable resin composition, the thermally curable resin composition comprising:
- a linear thermally curable resin;
- and
- amorphous silica fine particles having pore portions, the linear thermally curable resin curing to be a cured resin, which communicates with the pore portions of the amorphous silica fine particles.
A cured product of a thermally curable resin composition, the thermally curable resin composition comprising:
- a linear thermally curable resin composition;
- and
- amorphous silica fine particles having a honeycomb structure.
Dependencies are inferred from the claim text.