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US 2010/0249276 A1Published application
Curatives for epoxy compositions
AssigneeDesigner Molecules, Inc.
InventorStephen M. Dershem
Life of this patent
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Abstract
The invention provides epoxy and oxetane compositions including the novel acyloxy and N-acyl curing agents described herein. Use of invention curing agents result in cured adhesive compositions with remarkably increased adhesion and reduced hydrophilicity when compared to resins cured with other types of curing agents. Furthermore, the curatives of this invention do not interfere with free-radical cure and are thus suited for use in hybrid cure thermoset compositions.
Claims23
A curative for epoxy or oxetane resins having the structure of Formula I or Formula II:
- wherein each of R and R1 is, independently, selected from the group consisting of a substituted or an unsubstituted aliphatic, heteroaliphatic, aromatic, heteroaromatic, siloxane, maleimido, and cinnamyl moieties;
- Ar is selected from the group consisting of a substituted or an unsubstituted aryl or heteroaryl having between 6 and about 20 carbon atoms;
- and
- n is an integer having the value between 1 and about 11.
1 more element
Dependencies are inferred from the claim text.