Back to results
US 2010/0248596 A1Published application
CMP Pad Dressers with Hybridized Abrasive Surface and Related Methods
OwnerChien-Min Sunginventor
Life of this patent
Estimating the term…
Abstract
The present invention provides CMP pad dressers and methods for dressing or conditioning CMP pads. In one aspect, a method for conditioning a CMP pad can include cutting the CMP pad with superabrasive cutting elements and controlling a degree of contact between the CMP pad and the cutting elements using control elements. The degree of contact is established through placement of the control elements relative to the cutting elements.
Claims19
A method for conditioning a CMP pad, comprising:
- cutting the CMP pad with superabrasive cutting elements;
- and
- controlling a degree of contact between the CMP pad and the cutting elements using control elements, wherein the degree of contact is established through placement of the control elements relative to the cutting elements.
A CMP pad dresser, comprising:
- an organic matrix;
- a plurality of cutting elements partially embedded directly in the organic matrix, the cutting elements being arranged into a plurality of distinct cutting element regions;
- a plurality of control elements partially embedded directly in the organic matrix, the control elements being arranged into a plurality of distinct control element regions;
- and
- wherein the cutting element regions and the control element regions are positioned in an alternating pattern, and wherein the control element regions are spaced relative to the cutting element regions to control a degree of contact between the cutting elements and a CMP pad.
2 more elements
Dependencies are inferred from the claim text.