Abrasive tool for use as a chemical mechanical planarization pad conditioner

An abrasive tool comprising:

• a CMP pad conditioner including:
• a substrate having a first major surface, a second major surface opposite the first major surface, and a side surface extending between the first major surface and the second major;
• a first layer of abrasive grains attached to the first major surface;
• a second layer of abrasive grains attached to the second major surface;
• and
• a first sealing member extending in a peripheral direction along a portion of the side surface of the substrate.

An abrasive tool for use as a CMP pad conditioner comprising:

• a plate;
• and
• an abrasive article comprising:
• a substrate having a first major surface and a second major surface opposite the first major surface;
• a first layer of abrasive grains attached to the first major surface;
• a second layer of abrasive grains attached to the second major surface;
• and
• wherein the plate and abrasive article are removably coupled via a coupling mechanism.

An abrasive tool for use as a CMP pad conditioner comprising:

• an abrasive article comprising:
• a substrate having a first major surface and a second major surface opposite the first major surface;
• a first layer of abrasive grains attached to the first major surface;
• a second layer of abrasive grains attached to the second major surface;
• a plate comprising a magnet for removably coupling the plate and abrasive article.

A method of dressing a CMP pad comprising:

• coupling an abrasive article to a dressing machine, the abrasive article comprising a substrate having a first major surface and a second major surface opposite the first major surface, wherein the abrasive article comprises a first abrasive surface at the first major surface of the substrate, and a second abrasive surface at the second major surface of the substrate, and wherein the abrasive article is mounted on the dressing machine to expose the first abrasive surface;
• contacting the first abrasive surface to a surface of a first CMP pad and moving the first CMP pad relative to the first abrasive surface to condition the first CMP pad;
• inverting the abrasive article to expose the second abrasive surface;
• and
• contacting the second abrasive surface to a surface of a second CMP pad and moving the second CMP pad relative to the second abrasive surface to condition the second CMP pad.