Copper clad laminate, prepreg and method of reducing signal loss
AssigneeVentec Electronics (Suzhou) company limited
InventorsDai Xin PENG, Zhuo Wang
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Abstract
Provided herein are, among other things, epoxy resin varnishes and methods of making and using the same. In some embodiments, the epoxy resin varnishes comprise at least a filler such as silica. In certain embodiments, the epoxy resin varnishes provided herein are used for making laminates such as copper clad laminates. In further embodiments, the copper clad laminates provided herein are used for making printed circuit boards (PCBs).
Claims29
A prepreg comprising a partially cured epoxy resin composition and one or more glass fabrics embedded in the partially cured epoxy resin composition, wherein the one or more glass fabrics are opened or flattened before embedded in the partially cured epoxy resin.
A metal clad laminate comprising:
- a) an insulating layer;
- and
- b) a metal layer on at least one surface of the insulating layer;
- wherein the insulating layer comprising a cured epoxy resin composition and one or more glass fabrics embedded in the cured epoxy resin composition, and wherein the one or more glass fabrics are opened or flattened before embedded in the cured epoxy resin.
A method of preparing a prepreg comprising:
- (a) opening or flattening one or more glass fabrics;
- (b) impregnating the one or more glass fabrics with an epoxy resin varnish;
- and
- (c) drying the impregnated one or more glass fabrics at a temperature from about 100° C. to about 250° C.
A method of preparing a metal clad laminate comprising:
- (a) opening or flattening one or more glass fabrics;
- (b) impregnating the one or more glass fabrics with an epoxy resin varnish;
- (c) drying the impregnated one or more glass fabrics at a temperature from about 100° C. to about 250° C. to form a prepreg;
- and
- (d) contacting a metal foil with at least a surface of the prepreg;
- and thermopress-bonding the metal foil to the surface of the prepreg.
Dependencies are inferred from the claim text.