Implementing Enhanced Solder Joint Robustness for SMT Pad Structure
AssigneeInternational Business Machines Corporation
InventorsMark Kenneth Hoffmeyer, Steven Paul Ostrander, Sri M. Sri-Jayantha
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Abstract
A method and a surface mount technology (SMT) pad structure are provided for implementing enhanced solder joint robustness. The SMT pad structure includes a base SMT pad. The base SMT pad receives a connector for soldering to the SMT pad structure. A standoff structure having a selected geometry is defined on the base SMT pad to increase thickness of the solder joint for the connector.
Claims20
A surface mount technology (SMT) pad structure for implementing enhanced solder joint robustness comprising:
- a base SMT pad, said base SMT pad receiving a SMT connector lead for soldering to onto said base SMT pad;
- and
- a standoff structure having a selected geometry;
- said standoff structure being defined on said base SMT pad to increase thickness of the solder joint for the connector.
A method for implementing enhanced solder joint robustness with a surface mount technology (SMT) pad structure including a base SMT pad, said base SMT pad receiving a connector for soldering to onto said base SMT pad, said method comprising the steps of:
- creating a standoff structure on the base SMT pad, and
- providing said standoff structure with a selected geometry to increase thickness of the solder joint for the connector.
Dependencies are inferred from the claim text.