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US 2010/0248474 A1Published application
Method of forming coating-type film
AssigneeKabushiki Kaisha Toshiba
InventorKatsuhiro SATO
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Abstract
An aspect of the present invention, there is provided a method for providing a coating-type film, including, coating a solution including an organic metal compound on a surface of a substrate including a semiconductor substrate to form a coating film, heating the coating film to volatize a solvent in the coating film, and performing a treatment including at least one of a heat treatment, an ozone treatment and a moisture treatment to remove impurities from the coating film.
Claims12
A method of providing a coating-type film, comprising;
- coating a solution including an organic metal compound on a surface of a substrate including a semiconductor substrate to form a coating film;
- heating the coating film to volatize a solvent in the coating film;
- and
- performing a treatment including at least one of a heat treatment, an ozone treatment and a moisture treatment to remove impurities from the coating film.
1 more element
A method of providing a coating-type film, comprising;
- coating a solution including metal particles on a surface of a substrate including a semiconductor substrate to form a coating film;
- heating the coating film to volatize a solvent in the coating film;
- and
- performing a treatment including at least one of a heat treatment, an ozone treatment and a moisture treatment to remove impurities from the coating film.
1 more element
Dependencies are inferred from the claim text.