Method of manufacturing semiconductor device

A method of manufacturing a semiconductor device, connecting between a first bonding point and a second bonding point using a wire, the method comprising:

• a bump forming step of forming a bump by folding the wire to be stacked on the second bonding point, the bump including a bent wire convex portion on an opposite side from the first bonding point;
• a bonding step of looping the wire from the first bonding point toward the bump, positioning an inner chamfer of a capillary above the bent wire convex portion, bonding the wire by pressing the wire to an upper surface of the bump with a face portion at a tip end of the capillary, and forming a wire bent portion having a cut surface smaller than a cross-section of the wire on a side of the bent wire convex portion by pressing the wire to the bent wire convex portion with the inner chamfer;
• and
• a wire cutting step comprising pulling the wire up and cutting the wire at the wire bent portion.

A method of manufacturing a semiconductor device, connecting between a first bonding point and a second bonding point using a wire, the method comprising:

• a bump forming step of forming a bump by folding the wire to be stacked on the second bonding point, the bump including a bent wire convex portion on an opposite side from the first bonding point;
• a bonding step of looping the wire from the first bonding point toward the bump, and bonding the wire by pressing the wire to an upper surface of the bump with a face portion at a tip end of the capillary;
• a bent portion forming step of, after raising the capillary from an upper surface of the bump to a position at which a height of a tip end of the capillary is lower than a height of an upper end of the bent wire convex portion, moving the capillary from the first bonding point in a direction toward the bent wire convex portion, shearing a portion of the wire with a corner of the capillary, and forming a wire bent portion having a cut surface smaller than a cross-section of the wire on a side of the bent wire convex portion by pressing the wire to the bent wire convex portion with the inner chamfer of the capillary;
• and
• a wire cutting step comprising pulling the wire up and cutting the wire at the wire bent portion.

A method of manufacturing a semiconductor device, connecting between a first bonding point and a second bonding point using a wire, the method comprising:

• a bump forming step including:
• forming a bump by folding the wire to be stacked on the second bonding point;
• the bump including a bent wire convex portion on an opposite side from the first bonding point,
• forming a sloped wedge on an upper surface on the side of the first bonding point by pressing the wire with the face portion at the tip end of the capillary,
• moving the capillary from the sloped wedge in a direction toward the bent wire convex portion after raising the capillary from an upper surface of the sloped wedge to a height such that a tip end of the capillary is lower than a height of an upper end of the bent wire convex portion, shearing a portion of the wire with a corner of the capillary, and forming a wire bent portion having a cut surface smaller than a cross-section of the wire on a side of the bent wire convex portion by pressing the wire to the bent wire convex portion with the inner chamfer of the capillary, and
• pulling the wire up and cutting the wire at the wire bent portion;
• a bonding step of looping the wire from the first bonding point toward the bump, and bonding the wire by pressing the wire to an upper surface of the bump with a face portion at a tip end of the capillary;
• a bent portion forming step of, after raising the capillary from an upper surface of the sloped wedge to a height such that a tip end of the capillary is lower than a height of an upper end of the bent wire convex portion, moving the capillary from the sloped wedge in a direction toward the bent wire convex portion, shearing a portion of the wire with a corner of the capillary, and forming a wire bent portion having a cut surface smaller than a cross-section of the wire on a side of the bent wire convex portion by pressing the wire to the bent wire convex portion with the inner chamfer of the capillary;
• and
• a wire cutting step comprising pulling the wire up and cutting the wire at the wire bent portion.