Semiconductor device and manufacturing method of the same
AssigneeFujitsu Microelectronics Limited
InventorNaoyuki Watanabe
Life of this patent
Estimating the term…
Abstract
A semiconductor device includes a semiconductor element, a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, a sealing member sealing an edge surface of the transparent member and an edge part of the semiconductor element, and a shock-absorbing member provided between the edge surface of the transparent member and the sealing member and easing a stress which the transparent member receives from the sealing member or the semiconductor element.
Claims9
1-9. (canceled)
A manufacturing method of a semiconductor device, the semiconductor device including a semiconductor element and a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, the manufacturing method comprising the steps of:
- a) forming a piercing part in the transparent member adhered on an adhesive tape and forming a groove by cutting a part of the adhesive tape corresponding to the piercing part;
- b) filling in the piercing part and the groove with a material of a shock-absorbing part configured to ease a stress in the transparent member, and curing the material of the shock-absorbing part;
- c) cutting the material of the shock-absorbing part provided in the piercing part and the groove;
- and
- d) peeling off the transparent member from the adhesive tape.
A manufacturing method of a semiconductor device, the semiconductor device including a semiconductor element and a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, the manufacturing method comprising the steps of:
- a) forming a groove by cutting in an adhesive tape by a designated length;
- b) adhering the transparent member on the adhesive tape where the groove is formed;
- c) forming a piercing part having a width shorter than the groove of the adhesive tape, at a part of the transparent member corresponding to the groove of the adhesive tape;
- d) filling in between the semiconductor element and the transparent member with a material of an air part forming member, and curing the material of the air part forming member;
- e) filling in the piercing part with a material of a shock-absorbing part configured to ease a stress to the transparent member, and curing the material of the shock-absorbing part;
- f) cutting the material of the air part forming member provided in the groove and the material of the shock-absorbing part provided in the piercing part;
- and
- g) peeling off the transparent member from the adhesive tape.
A manufacturing method of a semiconductor device, the semiconductor device including a semiconductor element and a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, the manufacturing method comprising the steps of:
- a) forming a groove by cutting into an adhesive tape by a designated length;
- b) adhering the transparent member on the adhesive tape where the groove is formed;
- c) forming a piercing part having a width shorter than the groove of the adhesive tape, at a part of the transparent member corresponding to the groove of the adhesive tape;
- d) filling in between the semiconductor element and the transparent member with a material of an air part forming member, and curing the material of the air part forming member;
- e) applying the step c) again so that the piercing part is pierced again and a part of the material of the air part forming member provided in the groove is cut into;
- f) filling in a part of the groove where the material of the air part forming member is cut into and the piercing part with a material of a shock-absorbing part configured to ease a stress in the transparent member, and curing the material of the shock-absorbing part;
- g) cutting the material of the shock-absorbing part;
- and
- h) peeling off the transparent member from the adhesive tape.
A manufacturing method of a semiconductor device, the semiconductor device including a semiconductor element and a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, the manufacturing method comprising the steps of:
- a) forming a groove by cutting in an adhesive tape by a designated length;
- b) adhering the transparent member on the adhesive tape where the groove is formed;
- c) forming a piercing part having a width shorter than the groove of the adhesive tape, at a part of the transparent member corresponding to the groove of the adhesive tape;
- d) filling in the groove and the piercing part with a material of a shock-absorbing part configured to ease a stress to the transparent member, and curing the material of the shock-absorbing part;
- e) cutting the material of the shock-absorbing part provided in the groove and the piercing part;
- and
- f) peeling off the transparent member from the adhesive tape.
A manufacturing method of a semiconductor device, the semiconductor device including a semiconductor element and a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, the manufacturing method comprising the steps of:
- a) forming a piercing part in the transparent member adhered on the adhesive tape and cutting into a part of the adhesive tape corresponding to the piercing part, so that a first groove is formed;
- b) filling in the piercing part and the first groove with a material of a first shock-absorbing part configured to ease a stress to the transparent member, and curing the material of the first shock-absorbing part;
- c) cutting the material of the shock-absorbing part provided in the piercing part and the first groove so that a second groove whose width is less than the width of the first groove is formed;
- d) filling in the second groove with a material of a second shock-absorbing part configured to ease the stress in the transparent member, and curing the material of the second shock-absorbing part;
- e) cutting the material of the second shock-absorbing part provided in the second groove;
- and
- f) peeling off the transparent member from the adhesive tape.
A manufacturing method of a semiconductor device, the semiconductor device including a semiconductor element and a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, the manufacturing method comprising the steps of:
- a) forming a groove by cutting into an adhesive tape by a designated length;
- b) adhering the transparent member on the adhesive tape where the groove is formed;
- c) forming a piercing part having a width shorter than the groove of the adhesive tape, at a part of the transparent member corresponding to the groove of the adhesive tape;
- d) filling in between the semiconductor element and the transparent member with a material of an air part forming member, and curing the material of the air part forming member;
- e) filling in the piercing part with an air space forming material removable after a process for making a piece of the semiconductor device, and curing the air space forming material;
- f) cutting the material of the air part forming member provided in the groove and the material of the air space forming material provided in the piercing part;
- and
- g) peeling off the transparent member from the adhesive tape.
A manufacturing method of a semiconductor device, the semiconductor device including a semiconductor element and a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, the manufacturing method comprising the steps of:
- a) forming a piercing part in the transparent member adhered on the adhesive tape and cutting into a part of the adhesive tape corresponding to the piercing part, so that a first groove is formed;
- b) filling in the piercing part and the first groove with a material of a shock-absorbing part configured to ease a stress in the transparent member, and curing the material of the shock-absorbing part;
- c) cutting the material of the shock-absorbing part provided in the piercing part and the first groove so that a second groove whose width is less than the width of the first groove is formed;
- d) filling in the second groove with an air space forming material removable after a process for making a piece of the semiconductor device, and curing the air space forming material;
- e) cutting the material of the space forming material provided in the second groove;
- and
- f) peeling off the transparent member from the adhesive tape.
A manufacturing method of a semiconductor device, the semiconductor device including a semiconductor element and a transparent member separated from the semiconductor element by a designated length and facing the semiconductor element, the transparent member having an edge surface where a taper is formed, the manufacturing method comprising the steps of:
- a) forming a piercing part in the transparent member adhered on the adhesive tape and cutting into a part of the adhesive tape corresponding to the piercing part, so that a groove is formed;
- b) filling in the piercing part and the groove with a material of a shock-absorbing part configured to ease a stress to the transparent member, and curing the material of the shock-absorbing part;
- c) forming a taper groove having a substantially same inclination angle as the taper of the transparent member, in a substantially center of an upper part of the material of the shock-absorbing part;
- d) cutting the material of the shock-absorbing part provided in the piercing part and the groove;
- and
- e) peeling off the transparent member from the adhesive tape.
Dependencies are inferred from the claim text.