Method for Laser Singulation of Chip Scale Packages on Glass Substrates
AssigneeElectro Sceintific Industries, Inc.
InventorsPeter Pirogovsky, Jeffery A. Albelo, James O'Brien, Yasu Osako
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Abstract
An improved method for singulation of compound electronic devices is presented. Compound electronic devices are manufactured by combining two or more substrates into an assembly containing multiple devices. Presented are methods for singulation of compound electronic devices using laser processing. The methods presented provide fewer defects such as cracking or chipping of the substrates while minimizing the width of the kerf and maintaining system throughput.
Claims18
An improved method for singulation of compound electronic devices using a laser processing system, wherein a plurality of said compound electronic devices are manufactured in an assembly that includes a first substrate and a second substrate arranged in layers, said plurality of said compound electronic devices being arranged so as to provide streets between said compound electronic devices, and said laser processing system having a laser beam comprising parameters including focal spot, speed, wavelength, energy, spot size, spot shape, pulse width, pulse shape and pulse repetition rate, said laser beam operative to laser machine said assemblies, the improvement comprising:
- laser machining a through cut in said first substrate with said laser beam having first predetermined laser parameter values, said through cut coincident with one of said streets between said compound semiconductor devices;
- and
- laser machining a scribe in said second substrate with said laser beam having second predetermined laser parameter values, said scribe in said second substrate being aligned with said through cut in said first substrate;
- and
- singulating said compound electronic devices by mechanically cleaving said second substrate along said scribe.
An improved method for singulation of compound electronic devices using a laser processing system, wherein a plurality of said compound electronic devices are manufactured in an assembly that includes a first substrate and a second substrate arranged in layers, said plurality of said compound electronic devices being arranged so as to provide streets between said compound electronic devices, and said laser processing system having a laser beam comprising parameters including focal spot, speed, wavelength, energy, spot size, spot shape, pulse width, pulse shape and pulse repetition rate, said laser beam operative to laser machine said assemblies, the improvement comprising:
- laser machining a near through cut in said first substrate with said laser beam having first predetermined laser parameter values, said near through cut coincident with one of said streets between said compound semiconductor devices;
- and
- laser machining a scribe in said second substrate with said laser beam having second predetermined laser parameter values, said scribe in said second substrate being aligned with said near through cut in said first substrate;
- and
- singulating said compound electronic devices by mechanically cleaving said second substrate along said scribe.
Dependencies are inferred from the claim text.