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AssigneeNational Chiao Tung University
InventorsEdward-yi Chang, Li-Han Hsu, Chee-Way Oil, Wei-Cheng Wu, Chin-te Wang
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In a high frequency flip chip package process of a polymer substrate and a structure thereof, the structure is a one-layer structure packaged by a high frequency flip chip package process to overcome the shortcomings of a conventional two-layer structure packaged by the high frequency flip chip package process. The conventional structure not only incurs additional insertion loss and return loss in its high frequency characteristic, but also brings out a reliability issue. Thus, the manufacturing process of a ceramic substrate in the conventional structure still has the disadvantages of a poor yield rate and a high cost.
A high frequency flip chip package process of a polymer substrate, comprising:
3 The high frequency flip chip package process of a polymer substrate as recited in claim 1, wherein the first predetermined thickness is equal to 500 Å.
A high frequency flip chip package structure of a polymer substrate, comprising:
Dependencies are inferred from the claim text.