Back to results
US 2010/0248427 A1Published application
Method of handling a thin wafer
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsWing-Jin WU, Ku-Feng YANG, Wen-Chih CHIOU
Life of this patent
Estimating the term…
Abstract
A method of handling a thin wafer includes forming a support structure at the edge of a thinned wafer that is encapsulated by a protection layer. The support structure can be an adhesive layer enclosing the protection layer, a dielectric-filled trench embedded in the thinned wafer and surrounding the protection layer, or a housing affixing the edge of the thinned wafer.
Claims20
A method, comprising:
- providing a wafer having a first surface and a second surface opposite to the first surface;
- attaching the first surface of the wafer to a carrier, exposing the second surface of the wafer;
- thinning the wafer from the second surface, forming a thinned wafer;
- bonding a plurality of dies onto the thinned wafer;
- encapsulating the thinned wafer and the dies with a protection layer, leaving an uncovered region at the edge of the thinned wafer;
- forming a support structure on the uncovered region at the edge of the thinned wafer;
- and
- removing the carrier from the thinned wafer.
5 more elements
A method, comprising:
- providing a wafer having a first surface, a second surface opposite to the first surface and an edge area defined on the first surface;
- forming a trench at the edge area of the first surface of the wafer;
- filling the trench with a dielectric layer, forming a support structure;
- attaching the first surface of the wafer to a carrier, exposing the second surface of the wafer;
- thinning the wafer from the second surface, forming a thinned wafer and exposing one end of the support structure;
- bonding a plurality of dies onto the thinned wafer;
- encapsulating the thinned wafer and the dies with a protection layer, exposing at least a portion of the exposed end of the support structure;
- and
- removing the carrier from the thinned wafer.
6 more elements
Dependencies are inferred from the claim text.