High-volume manufacturing massive e-beam maskless lithography system
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsJeng-Horng Chen, Shy-Jay Lin, Burn Jeng Lin
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Abstract
The present disclosure provides a maskless lithography apparatus. The apparatus includes a plurality of writing chambers, each including: a wafer stage operable to secure a wafer to be written and a multi-beam module operable to provide multiple radiation beams for writing the wafer; an interface operable to transfer wafers between each of the writing chambers and a track unit for processing an imaging layer to the wafers; and a data path operable to provide a set of circuit pattern data to each of the multiple radiation beams in each of the writing chambers.
Claims20
A maskless lithography apparatus, comprising:
- a plurality of writing chambers, each including:
- a substrate stage operable to secure a substrate to be written;
- a multi-beam module operable to provide multiple radiation beams each directed for writing a portion of the substrate;
- and
- a load lock operable to provide the substrate to the substrate stage;
- an interface operable to transfer the substrate to the substrate stage of the respective writing chamber;
- a data path operable to provide a set of circuit pattern data to the multi-beam module of each of the writing chambers;
- and
- a clock module operable to provide a clock signal to the multi-beam module of each of the writing chambers for synchronization.
A maskless lithography apparatus, comprising:
- a plurality of writing chambers, each including:
- a wafer stage operable to secure a wafer to be written;
- and
- a multi-beam module operable to provide multiple radiation beams for writing the wafer;
- an interface operable to transfer wafers between each of the writing chambers and a track unit for processing an imaging layer to the wafers;
- and
- a data path operable to provide a set of circuit pattern data to each of the multiple radiation beams in at least two of the writing chambers.
A method to pattern a plurality of substrates, comprising:
- forming an imaging layer on each of the substrates, the imaging layer being sensitive to a radiation energy;
- transferring the substrates to a maskless lithography apparatus including:
- a plurality of writing chambers each having a multi-beam module configured to provide multiple radiation beams of the radiation energy, each of the multiple radiation beams being directed for writing a portion of a substrate;
- and
- a data path configured to provide a set of circuit pattern data to the multi-beam module of each of the writing chambers;
- providing the set of circuit pattern data through the data path to the multi-beam module of each of the writing chambers;
- and
- simultaneously writing to each of the substrates by the respective multi-beam module in accordance with the set of circuit pattern data.
Dependencies are inferred from the claim text.