Polyamic acid solution composition having carbon black dispersed therein, process for production of semiconductive polyimide resin belt using the composition, and semiconductive polyimide resin belt
AssigneesGunze Limited, Ube Industries, Ltd.
InventorsNaoki Nishiura, Akira Ichino, Takashi Kuraoka, Toru Murakami, Takeshige Nakayama
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