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US 2010/0247879 A1Published application
Substrate warpage-reducing structure
AssigneeHong Kong Applied Science and Technology Researh Institute Co. Ltd.
InventorsJyh-Rong Lin, Bin Xie, Yeung Yeung, Xunqing Shi, Chang Hwa Chung
Life of this patent
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Abstract
The subject matter disclosed herein relates to methods to reduce warpage of a substrate.
Claims26
A method comprising:
- arranging a first surface-modifying material on a first surface of a substrate, said first surface-modifying material having a first pattern comprising one or more thicknesses to control warpage of said substrate.
The method of claim A1, further comprising:
- forming grooves in said first surface of said substrate before said arranging said first surface-modifying material.
The method of claim A1, wherein said first surface-modifying material has a first coefficient of thermal expansion (CTE) and said substrate has a second CTE.
The method of claim A1, wherein said substrate comprises a ceramic substrate.
A device comprising:
- a substrate having a first coefficient of thermal expansion (CTE);
- and
- a first surface-modifying material having a second CTE, said first surface-modifying material disposed on a first surface of said substrate, wherein
- a change in an amount of warpage of said substrate is responsive, at least in part, to a difference between said first CTE and said second CTE during a temperature change of said device, and
- said first surface-modifying material is disposed on said first surface of said substrate in a first pattern that exposes portions of said first surface of said substrate so that said amount of warpage comprises a reduced amount of warpage.
2 more elements
An apparatus comprising:
- means for arranging a first surface-modifying material on a first surface of a substrate, said first surface-modifying material having a first pattern comprising one or more thicknesses to control warpage of said substrate.
Dependencies are inferred from the claim text.