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US 2010/0247802 A1Published application
Method for making device housing
AssigneesShenzhen Futaihong Precision Industry Co., Ltd., FIH (Hong Kong) Limited
InventorsBEN-DING TSAO, WEN-LIN XIONG, XIAN-MING WU, JIAN-BAO HAN, DIAN-MING ZHU, CHONG CAI
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Abstract
A method for making device housing comprises: providing a transparent film; forming a coating on one surface of the film by printing ink containing metal powder on the film and ultrasonically treating the coating; and molding a substrate onto the coating.
Claims6
A method for making device housing, comprising:
- providing a transparent film;
- forming a coating on one surface of the film by printing ink containing metal powder on the film;
- ultrasonically treating the coating;
- and
- molding a substrate onto the coating.
2 more elements
A method for making device housing, comprising:
- providing a transparent film;
- forming a coating on a portion of surface of the film by printing ink containing metal powder on the film;
- ultrasonically treating the coating;
- and
- molding a substrate onto the coating and the film.
2 more elements
Dependencies are inferred from the claim text.