Stacked memory devices
AssigneeSamsung Electronics Co., Ltd.
InventorsSeung-eon Ahn, Ho-jung Kim, Chul-woo Park, Sang-beom Kang, Hyun-ho Choi
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AssigneeSamsung Electronics Co., Ltd.
InventorsSeung-eon Ahn, Ho-jung Kim, Chul-woo Park, Sang-beom Kang, Hyun-ho Choi
Estimating the term…
A stacked memory device may include a substrate, a plurality of memory layers stacked on and above the substrate and divided into a plurality of groups, a plurality of inter-decoders electrically connected to and disposed between the plurality of memory layers in a corresponding one of the plurality of groups, and at least one pre-decoder electrically connected to the plurality of inter-decoders and disposed between the plurality of inter-decoders. A stacked memory device may include a substrate, a plurality of memory layers stacked on and above the substrate and divided into a plurality of groups, a plurality of inter-drivers electrically connected to and disposed between the plurality of memory layers in a corresponding one of the plurality of groups, and at least one pre-driver electrically connected to the plurality of inter-drivers, and disposed between the plurality of inter-drivers.
A stacked memory device, comprising:
A stacked memory device, comprising:
Dependencies are inferred from the claim text.