Thermal Management For LED Lighting

A lighting device comprising:

• a housing;
• a heat sink assembly received within the housing, said heat sink assembly consisting of a first heat sink member and a second heat sink member, said first heat sink member and said second heat sink member being formed of aluminum;
• a printed circuit board secured to both of a connecting portion of the first heat sink member, and a connecting portion of the second heat sink member;
• at least one high-power LED provided on the printed circuit board, said at least one high-power LED being capable of continuous use of ≧1 W of electrical power;
• an optic mounted to the printed circuit board for the at least one high-power LED;
• a pair of slotted spring pins, each of said slotted spring pins being received in a conduit defined by aligned grooves provided in the first heat sink member and the second heat sink member, said slotted spring pins biasing an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing;
• and
• a lens operatively associated with the housing for covering the at least one high-power LED.

A method for manufacturing a lighting device, the method comprising:

• inserting a heat sink assembly comprising a first heat sink member and a second heat sink member into a housing;
• inserting at least one biasing member between the first heat sink member and the second heat sink member to bias an outer side of the first heat sink member and an outer side of the second heat sink member into contact with an inner side of the housing;
• and
• securing a printed circuit board comprising at least one high-power LED to both of the first heat sink member and the second heat sink member.