Light emitting device and method for manufacturing the same
AssigneesHarison Toshiba Lighting Corp., Kabushiki Kaisha Toshiba
InventorNaoki Wada
Life of this patent
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Abstract
A light emitting device, includes: a casing; a window; a semiconductor laser provided in an enclosed space formed by the casing and the window; and a fluorescent material in a form of any one of a crystal and glass, the fluorescent material being provided in the enclosed space, the fluorescent material absorbing laser light emitted from the semiconductor laser and emitting secondary light having a wavelength different from a wavelength of the laser light, and the secondary light being taken out through the window.
Claims20
A light emitting device, comprising:
- a casing;
- a window;
- a semiconductor laser provided in an enclosed space formed by the casing and the window;
- and
- a fluorescent material in a form of any one of a crystal and glass, the fluorescent material being provided in the enclosed space,
- the fluorescent material absorbing laser light emitted from the semiconductor laser and emitting secondary light having a wavelength different from a wavelength of the laser light, and
- the secondary light being taken out through the window.
A light emitting device, comprising:
- a casing;
- a window;
- and
- a semiconductor laser provided in an enclosed space formed by the casing and the window,
- the window including a fluorescent material provided without being exposed to the enclosed space,
- the fluorescent material absorbing laser light emitted from the semiconductor laser and emitting secondary light having a wavelength different from a wavelength of the laser light, and
- the secondary light being taken out through the window.
A light emitting device, comprising:
- a semiconductor substrate having a recessed portion formed in a main surface with a first plane orientation, the recessed portion having a side surface with a second plane orientation;
- a semiconductor laser mounted in the recessed portion;
- a fluorescent material in a form of any one of a crystal and glass, the fluorescent material being fixed to the main surface of the semiconductor substrate and encapsulating the semiconductor laser in an enclosed space formed in the recessed portion;
- a first electrode extending on an opposite main surface of the semiconductor substrate from the main surface, the first electrode being connected to one of main electrodes of the semiconductor laser;
- and
- a second electrode extending on a side surface of the semiconductor substrate, the second electrode being connected to another one of the main electrodes of the semiconductor laser,
- the fluorescent material absorbing laser light emitted from the semiconductor laser and reflected by the side surface of the recessed portion and emitting secondary light having a wavelength different from a wavelength of the laser light.
A method for manufacturing a light emitting device, comprising:
- forming a recessed portion in a main surface of a semiconductor substrate, the main surface being with a first plane orientation, the recessed portion having a side surface with a second plane orientation;
- mounting a semiconductor laser on a bottom surface of the recessed portion;
- forming a surface electrode on the main surface of the semiconductor substrate and connecting the surface electrode to the semiconductor laser;
- and
- bonding a fluorescent material in a form of any one of a crystal and glass to the main surface of the semiconductor substrate to encapsulate the semiconductor laser within the recessed portion.
Dependencies are inferred from the claim text.