Electronic device and method of producing the same
AssigneeDenso Corporation
InventorsKeiichi Sugimoto, Mitsuru Nakagawa
Life of this patent
Estimating the term…
Abstract
A method of producing an electronic device includes a holding of a circuit board and a decoration sheet in a cavity of a mold, and a filling and solidifying of thermosetting resin in the cavity. A casing is molded by the solidified thermosetting resin so as to seal electronic parts and a first face of the circuit board having the electronic parts. Further, the decoration sheet is integrated with the casing by the solidified thermosetting resin. An outer surface of the casing is defined by a second face of the circuit board opposite from the first face and the decoration sheet.
Claims10
A method of producing an electronic device comprising:
- mounting electronic parts on only a first face of a circuit board;
- holding the circuit board in a cavity of a mold in a manner that a second face of the circuit board opposite from the first face is tightly contact with a first inner face of the mold;
- holding a decoration sheet between the first face of the circuit board and a second inner face of the mold opposing to the first face of the circuit board, the decoration sheet having a transparent base made of thermoplastic resin and a decoration layer layered on the base, the decoration layer opposing to the first face of the circuit board;
- filling thermosetting resin into the cavity after the holdings of the circuit board and the decoration sheet;
- and
- solidifying the filled resin, such that a casing is molded by the solidified resin so as to seal the electronic parts and the first face of the circuit board in a manner that the second face of the circuit board defines a part of an outer surface of the casing, wherein
- the solidifying of the filled resin integrates the decoration sheet and the casing, such that the decoration sheet defines a part of the outer surface of the casing.
An electronic device comprising:
- a circuit board having a first face and a second face opposite from each other;
- electronic parts mounted on only the first face of the circuit board;
- a casing to seal the first face of the circuit board and the electronic parts, the casing being made of thermosetting resin;
- and
- a decoration sheet integrated with the casing, the decoration sheet having
- a transparent base made of thermoplastic resin, and
- a decoration layer layered on a first face of the transparent base, wherein
- the transparent base has a second face opposite from the decoration layer, and
- the casing has an outer surface defined by the second face of the circuit board and the second face of the transparent base.
Dependencies are inferred from the claim text.