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US 2010/0246138 A1Published application
Method, apparatus, and system for thin die thin thermal interface material in integrated circuit packages
OwnerWei Shi, Daoqiang Lu +1inventors
InventorsWei Shi, Daoqiang Lu, Edward A. Zarbock
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Abstract
Some embodiments of the invention include a thermal interface between a heat spreader and a die. The thermal interface may include a main layer of a single material or a combination of multiple materials. The thermal interface may include one or more additional layers covering one or more surfaces of the main layer. The thermal interface may be bonded to the die and the heat spreader at a low temperature, with flux or without flux. Other embodiments are described and claimed.
Claims20
An apparatus comprising:
- a die;
- a heat spreader;
- and
- a thermal interface bonded to the die and the heat spreader, wherein the thermal interface includes indium and an additional material.
1 more element
An apparatus comprising:
- a die;
- a heat spreader;
- and
- a thermal interface bonded to the die and the heat spreader, wherein the thermal interface includes only a single material.
1 more element
A system comprising:
- a die;
- a heat spreader;
- a thermal interface bonded to the die and the heat spreader, wherein the thermal interface includes indium and an additional material;
- and
- a random access memory device coupled to the die.
2 more elements
Dependencies are inferred from the claim text.