Thermal-electrical assembly for a portable communication device

A thermal-electrical assembly for a plurality of electrical components, comprising:

• a printed circuit board having a solderable track surrounding the plurality of components;
• a shield soldered to the track, the shield having an aperture formed therein exposing a heat dissipating component of the plurality of electrical components;
• a gasket having electrically and thermally conductive properties, the gasket having contoured edges within which to mount to the aperture of the shield such that the gasket makes contact with the shield and the heat dissipating component about the aperture;
• and
• a thermal insert configured to fill and be retained by the gasket, the thermal insert making contact with the heat dissipating component.

A power amplifier assembly, comprising:

• a substrate having electrical power amplification components mounted thereon, at least a portion of which are heat generating components;
• a shield mounted to the substrate over the electrical power amplification components, the shield having a windowed aperture exposing at least a portion of the heat generating components;
• a pliable frame formed of thermally and electrically conductive material mounted about the windowed aperture and contacting the exposed heat generating components;
• and
• a thermal insert formed to fit and mounted within the pliable frame, the pliable frame and thermal insert closing off the shield and contacting the heat generating components, the pliable frame providing electrical ground and the thermal insert providing heat dissipation to the heat generating components.