Method and apparatus for distributing a thermal interface material

A system, comprising:

• an integrated circuit chip;
• a heat sink;
• and
• a compliant thermal interface material (TIM) distributed in a predetermined pattern between the integrated circuit chip and the heat sink;
• wherein a mating surface of the heat sink and a mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the TIM is pressed between the mating surface of heat sink and a corresponding mating surface of the integrated circuit chip during assembly of the system.

A method for assembling a system which includes an integrated circuit chip and a heat sink, comprising:

• applying a compliant thermal interface material (TIM) to at least one of a mating surface of the heat sink and a corresponding mating surface of the integrated circuit chip;
• and
• pressing together the mating surface of the heat sink and the mating surface of the integrated circuit chip;
• wherein the mating surface of the heat sink and the mating surface of the integrated circuit chip are shaped to distribute the TIM in the predetermined pattern as the mating surface of heat sink the mating surface of the integrated circuit chip are pressed together.