Back to results
US 2010/0246129 A1Published application
Electronic Apparatus
AssigneeKabushiki Kaisha Toshiba
InventorTakeshi Hongo
Life of this patent
Estimating the term…
Abstract
An electronic apparatus including: a body; a circuit board housed in the body; a heating body mounted on the circuit board; a heat pipe having: an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body; a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion; and an extension that extends toward the circuit board.
Claims10
An electronic apparatus comprising:
- a body;
- a circuit board housed in the body;
- a heating body mounted on the circuit board;
- a heat pipe having:
- an end portion, a heat emitting portion located on an opposite side to the end portion, and a heat receiving portion located between the end portion and the heat emitting portion and thermally connected to the heating body;
- a bonding member disposed between the heating body and the heat receiving portion and that bonds the heating body and the heat receiving portion;
- and
- an extension that extends toward the circuit board.
5 more elements
Dependencies are inferred from the claim text.