Heat dissipation device and method for manufacturing the same
AssigneesFu Zhun Precision Industry (Shen Zhen) Co., Ltd., Foxconn Technology Co., Ltd.
InventorsXIN-LEI LIU, JIN-BIAO LIU, HONG-CHENG YANG, CHUN-CHI CHEN
Life of this patent
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Abstract
A heat dissipation device for dissipating heat from an electronic component mounted on a printed circuit board, includes a fin unit, a centrifugal fan located adjacent to the fin unit, a heat-conducting board attached to the electronic component and a heat pipe thermally connecting the fin unit and the electronic component. An engaging portion protrudes upwardly from a top face of the heat-conducting board. The heat pipe has an evaporating section extending through the engaging portion and being fixed to the top face of the heat-conducting board, and a condensing section attached to the fin unit.
Claims17
A heat dissipation device adapted for dissipating heat from an electronic component mounted on a printed circuit board, the heat dissipation device comprising:
- a fin unit;
- a heat-conducting board for being attached to the electronic component;
- and
- a heat pipe thermally connecting the fin unit and the heat-conducting board;
- wherein an engaging portion protruding upwardly from a top face of the heat-conducting board, the heat pipe extending through the engaging portion to be fixed to the top face of the heat-conducting board.
A method for manufacturing a heat dissipation device adapted for dissipating heat from an electronic component mounted on a printed circuit board, comprising:
- 1) providing a planar heat-conducting board;
- 2) stamping the heat-conducting board to form an engaging portion protruding upwardly from a top face of the heat-conducting board, and the engaging portion comprising a pressing section located above the top face of the heat-conducting board, and two bended connecting arms interconnecting two opposite ends of the pressing portion and the heat-conducting board, respectively;
- 3) providing a heat pipe comprising an evaporating section extending through the engaging portion, a condensing section bent from the evaporating section, and a connecting section interconnecting the evaporating section and the condensing section;
- 4) pressing the two connecting arms of the engaging portion downwardly, thereby driving the pressing section to move downwardly and abut against the evaporating section of the heat pipe;
- and
- 5) providing a fin unit thermally engaging with the condensing section of the heat pipe.
Dependencies are inferred from the claim text.