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US 2010/0246125 A1Published application
Electronic Apparatus
AssigneeKabushiki Kaisha Toshiba
InventorIsao Okutsu
Life of this patent
Estimating the term…
Abstract
An electronic apparatus includes: a housing; a circuit board accommodated in the housing; a face mounting component mounted on the circuit board; a heating component mounted on the circuit board; a reinforcing member having a thermal conductivity and configured to reinforce a region on the circuit board on which the face mounting component is mounted; and a radiation unit extended from the reinforcing member and connected thermally to the heating component.
Claims11
An electronic apparatus comprising:
- a housing;
- a circuit board accommodated in the housing;
- a face mounting component mounted on the circuit board;
- a heating component mounted on the circuit board;
- a reinforcing member having a thermal conductivity and configured to reinforce a region on the circuit board on which the face mounting component is mounted;
- and
- a radiation unit extended from the reinforcing member and connected thermally to the heating component.
4 more elements
An electronic apparatus comprising:
- a housing;
- a circuit board accommodated in the housing and having a first face and a second face positioned on an opposite side to the first face;
- a face mounting component mounted on the first face of the circuit board;
- a heating component mounted on the second face of the circuit board;
- a reinforcing member having a rigidity and opposed to the face mounting component, the circuit board interposed between the reinforcing member and the face mounting component;
- and
- a radiation unit attached to the reinforcing member and connected thermally opposite to the heating component.
4 more elements
An electronic apparatus comprising:
- a housing;
- a circuit board accommodated in the housing;
- a face mounting component mounted on the circuit board;
- a heating component mounted on the circuit board;
- a reinforcing member having a rigidity and configured to reinforce a region on the circuit board on which the face mounting component is mounted;
- a cooling fan accommodated in the housing;
- a radiation member disposed opposite to the cooling fan;
- a heat transferring member provided over the heating component and the radiation member and having a heat receiving portion opposed to the heating component;
- and
- a pressing portion having an abutting face configured to abut on the heat receiving portion of the heat transferring member and configured to press the heat receiving portion of the heat transferring member from the abutting face toward the heating component through an attachment of an end to the reinforcing member.
7 more elements
Dependencies are inferred from the claim text.