Variable flow computer cooling system for a data center and method of operation

A computer system comprising:

• a processor having a first side and a second side;
• a group of memory components electrically coupled to said processor;
• a power electronics module electrically coupled to provide electrical power to said processor and said group of memory components;
• a liquid cooling loop thermally coupled to said processor, said group of memory components and said power electronics module;
• and,
• a cold plate thermally coupled to said processor and fluidly coupled to said liquid cooling loop, said cold plate including:
• a first inlet having a first diameter fluidly coupled to said liquid cooling loop;
• a second inlet having a second diameter fluidly coupled to said liquid cooling loop, said second diameter being larger than said first diameter;
• a first nozzle fluidly coupled to said first inlet;
• a second nozzles fluidly coupled to said second inlet;
• a first channel fluidly coupled to said first nozzle;
• and,
• a second channel fluidly coupled to said second nozzle;
• wherein said first nozzle is arranged to direct a flow of cooling fluid to said processor first side at a first velocity and said second nozzle is arranged to direct a flow of cooling fluid at a second velocity;
• and;
• wherein said first channel and said second channel are arranged to flow said cooling fluid from said processor first side to said liquid cooling loop.