Defect inspecting method and defect inspecting apparatus
AssigneeTokyo Electron Limited
InventorsMisako Saito, Teruyuki Hayashi, Kaoru Fujiwara
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Abstract
Provided is a method and apparatus for inspecting a defect of a shape formed on a substrate. Primary inspection is sequentially performed on specific patterns in a plurality of divided regions of the substrate by using an optical method, and one or more regions on which secondary inspection is to be performed are selected from the regions. One or more defects are detected by performing the secondary inspection using an electron beam on the selected regions.
Claims8
A method for inspecting a defect of a shape formed on a substrate, comprising:
- a first step of sequentially performing primary inspection on specific patterns in a plurality of divided regions of the substrate using an optical method, and selecting one or more regions on which secondary inspection is to be performed from the plurality of regions;
- and
- a second step of detecting one or more defects by performing the secondary inspection using an electron beam on the regions selected in the first step.
An apparatus for inspecting a defect of a shape formed on a substrate, comprising:
- an optical inspection apparatus for sequentially performing primary inspection on specific patterns in a plurality of divided regions of the substrate using an optical method, and selecting one or more regions on which secondary inspection is to be performed from the plurality of regions;
- and
- an electron beam inspection apparatus for detecting one or more defects by performing the secondary inspection using an electron beam on the regions selected by the optical inspection apparatus.
Dependencies are inferred from the claim text.