Solid-state imaging device, method of manufacturing the same, and electronic apparatus
AssigneeSony Corporation
InventorKazuichiro Itonaga
Life of this patent
Estimating the term…
Abstract
A solid-state imaging device includes: an on-chip color filter having color filter components formed to correspond to pixels; light-shielding members each formed at the boundary of adjacent color filter components; and lenses concave toward a light incident direction, each formed directly below a corresponding one of the color filter components by self-alignment with the light-shielding members as a mask.
Claims14
A solid-state imaging device comprising:
- an on-chip color filter having color filter components formed to correspond to pixels;
- light-shielding members each formed at the boundary of adjacent color filter components;
- and
- lenses concave toward a light incident direction, each formed directly below a corresponding one of the color filter components by self-alignment with the light-shielding members as a mask.
A solid-state imaging device comprising:
- an on-chip color filter having color filter components formed to correspond to pixels;
- light-shielding members each formed at the boundary of adjacent color filter components;
- and
- lenses concave toward a light incident direction, each formed directly below a corresponding one of the color filter components by self-alignment with respect to a base layer.
A method of manufacturing a solid-state imaging device, the method comprising the steps of:
- forming light-shielding members each at the upper part between adjacent pixels;
- selectively removing a base layer by self-alignment with the light-shielding members as a mask;
- burying a first insulating film having concave portions surrounded by sidewalls inclined at a predetermined angle in the removed portions by a high-density plasma deposition method;
- burying a second insulating film in the concave portions of the first insulating film to form lens concave toward a light incident direction by self-alignment;
- and
- forming color filter components directly above the respective lenses between adjacent light-shielding members to form an on-chip color filter.
A method of manufacturing a solid-state imaging device, the method comprising the steps of:
- selectively removing a base layer corresponding to photoelectric converters of a plurality of pixels to form concave portions;
- forming a first insulating film continuously from the removed portions selectively removed by a high-density plasma deposition method to the upper part of wiring so as to have concave portions surrounded by sidewalls inclined at a predetermined angle;
- burying a second insulating film in the concave portions of the first insulating film to form lenses concave toward a light incident direction by self-alignment;
- selectively forming light-shielding members on surfaces between the photoelectric converters of the respective pixels;
- and
- forming color filter components surrounded by the light-shielding members directly above the respective lenses to form an on-chip color filter.
An electronic apparatus comprising:
- a solid-state imaging device;
- an optical system guiding incident light to photoelectric converters of the solid-state imaging device;
- and
- a signal processing circuit processing an output signal of the solid-state imaging device,
- wherein the solid-state imaging device has
- an on-chip color filter having color filter components formed to correspond to pixels,
- light-shielding members each formed at the boundary of adjacent color filter components, and
- lenses concave toward a light incident direction, each formed directly below a corresponding one of the color filter components by self-alignment.
Dependencies are inferred from the claim text.