Apparatus for mass die testing
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorTsung-Yang Hung
Life of this patent
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Abstract
A test system for testing a large number of dice on a semiconductor wafer without repositioning test probes is disclosed. The test system includes a set of dice under test (DUT) connected together by a plurality of signal buses formed on a semiconductor wafer, at least one test die designed for carrying out tests of the dice under test, the test die having a set of pads to be connected to one or more probes of an external test apparatus, and a probe card with at least one multiplexer implemented in the probe card, such that the test die is capable of receiving signals from the external test apparatus to select any die under test within the set via the multiplexer and the signal buses without repositioning the probes.
Claims20
A test system comprising:
- a set of dice under test (DUT) connected together by a plurality of signal buses formed on a semiconductor wafer;
- at least one built-in self test (BIST) die formed separate from the set of DUT, the BIST die being connected to each DUT within the set through the signal buses for carrying out tests of each DUT;
- a probe card including a set of probes for forming electrical contacts with the DUT via one or more pads on the BIST die, wherein the probe card includes at least one multiplexer;
- a test apparatus coupled to the probe card for sending test signals to the multiplexer of the probe card to select any DUT within the set, and for receiving output signals from the DUT for analysis through the multiplexer without repositioning the set of probes, the test apparatus comprises:
- a control device for analyzing the output signals from the DUT and for providing address signals to the probe card via an addressing bus, the probe card providing a plurality of physical connections to the BIST die for selecting one or more DUTs for testing based on the address signals;
- a set of testers coupled to the control device;
- and
- a set of matching modules configured to couple radio frequency (RF) signals between the probe card and the set of testers.
A test system for testing a radio frequency device, comprising:
- a set of dice under test (DUT) connected together by a plurality of signal buses formed on the semiconductor wafer;
- one or more built-in self test (BIST) die formed separate from the set of DUT, the BIST die being connected to each DUT within the set through the signal buses for carrying out tests of each DUT;
- a probe card including a set of RF probes operatively connected to one or more pads on the BIST die for passing test signals, wherein the probe card includes at least one multiplexer;
- a test apparatus coupled to the probe card for sending the test signals to the multiplexer of the probe card to select any DUT within the set, and for receiving output signals from the DUT for analysis through the multiplexer without repositioning the set of probes, the test apparatus comprises:
- a control device for analyzing the output signals from the DUT and for providing address signals to the probe card via an addressing bus, the probe card providing a plurality of physical connections to the BIST die for selecting one or more DUTs for testing based on the address signals;
- a set of testers coupled to the control device;
- and
- a set of matching modules configured to couple RF signals between the probe card and the set of testers.
Dependencies are inferred from the claim text.