Method and apparatus for controlling position of z-axis for wafer prober
AssigneeSemics Inc.
InventorYoung-Ho Ko
Life of this patent
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AssigneeSemics Inc.
InventorYoung-Ho Ko
Estimating the term…
The present invention relates to a method and apparatus for controlling the Z axis position of a wafer prober. The apparatus includes a first sensor unit (316) including a plurality of pressure sensors distributed and installed between a Z axis support plate, for supporting a Z axis transferring unit (315), and a Z axis base (321). Actuators (326 to 332) are distributed and installed between the Z axis support plate and the Z axis base, and lift up or lower the Z axis support plate (321). A driving unit drives the actuators. A control module (300) controls the driving unit to drive the actuators in response to pieces of sensed data. The control module drives the actuators when a difference between the pieces of sensed data is greater than a preset difference limit value, thus enabling the chuck plate to be maintained in a horizontal state.
An apparatus for controlling a Z axis position of a wafer prober, the wafer prober including a chuck plate, a Z axis transferring unit for vertically transferring the chuck plate, and a Z axis base for supporting the Z axis transferring unit, comprising:
A method of controlling a Z axis position of a wafer prober, the method being performed by a control module, which controls an operation of a Z axis transferring unit for vertically transferring a chuck plate of the wafer prober, comprising the steps of:
Dependencies are inferred from the claim text.