Method for setting contact parameter and recording medium having program for setting contact parameter recorded thereon

A method to set contact parameters for contacting a semiconductor wafer with a plurality of probes and separating the semiconductor wafer from the plurality of probes by moving a semiconductor wafer in order to perform an electrical property test on devices formed on the semiconductor wafer through an electrical contact between electrode pads of the devices and the plurality of probes, the method comprising:

• preparing, on a display screen of a computer, a coordinate graph comprising a first axis indicating a time, and a second axis indicating a movement distance of the semiconductor wafer;
• and
• setting contact parameters by specifying a plurality of points on the coordinate graph by a plurality of movement positions of the semiconductor wafer on the second axis and time required for the semiconductor wafer to move until reaching the plurality of movement positions, respectively, on the first axis, and displaying a broken-line graph through connecting the specified plurality of points on the coordinate graph with straight-lines.

A method to set contact parameters for contacting a semiconductor wafer with a plurality of probes and separating the semiconductor wafer from the plurality of probes by moving up and down the semiconductor wafer in order to perform an electrical property test on devices formed on the semiconductor wafer through an electrical contact between electrode pads of the devices and the plurality of probes, the method comprising:

• preparing, on a display screen of a computer, a coordinate graph comprising a first axis indicating a time, and a second axis indicating an upward/downward movement distance of the semiconductor wafer;
• and
• setting contact parameters by specifying a plurality of points by a plurality of upward/downward movement positions of the semiconductor wafer on the second axis during electrical contact of the electrode pads of the semiconductor wafer with the plurality of probes and separation of the electrode pads of the semiconductor wafer from the plurality of probes, and time required for the semiconductor wafer to move upward/downward until reaching the upward/downward movement positions, respectively, on the first axis, and displaying a broken-line graph through connecting the specified plurality of points on the coordinate graph with straight-lines.