Probe for electrical inspection, method for fabricating the same, and method for fabricating a semiconductor device
AssigneeKabushiki Kaisha Toshiba
InventorsMasayuki UCHIDA, Kazuhito Higuchi, Tomohiro Iguchi
Life of this patent
Estimating the term…
Abstract
An aspect of the present disclosure, there is provided An electrical inspection probe, including, a leading end portion of the electrical inspection probe, the leading end portion contacting with a solder bump located outward the electrical inspection probe, a base material configured at the leading end portion, the base material being constituted with a conductive material, a gold layer on a surface of the base material at least in the leading end portion, a rhodium layer on a surface of the gold layer at least in the leading end portion, and a ruthenium layer on a surface of the rhodium layer at least in the leading end portion.
Claims12
An electrical inspection probe, comprising:
- a leading end portion of the electrical inspection probe, the leading end portion contacting with a solder bump located outward the electrical inspection probe;
- a base material configured at the leading end portion, the base material being constituted with a conductive material;
- a gold layer on a surface of the base material at least in the leading end portion;
- a rhodium layer on a surface of the gold layer at least in the leading end portion;
- and
- a ruthenium layer on a surface of the rhodium layer at least in the leading end portion.
A method for manufacturing an electrical inspection probe, comprising:
- preparing a base material constituted with conductive material;
- forming a leading end portion at an end portion of the base material;
- forming a gold layer on a surface of the base material;
- forming a rhodium layer on a surface of the gold layer at least in the leading end portion;
- and
- forming a ruthenium layer on a surface of the rhodium layer at least in the leading end portion.
A method for manufacturing a semiconductor device, comprising:
- contacting a leading end portion of an electrical inspection probe to a solder bump of an LSI;
- and
- performing an electrical inspection on the LSI;
- the electrical inspection probe comprising;
- a base material constituted with a conductive material;
- a gold layer on a surface of the base material;
- a rhodium layer on a surface of the gold layer at least in the leading end portion of the base material;
- a ruthenium layer on a surface of the rhodium layer at least in the leading end portion of the base material.
Dependencies are inferred from the claim text.