Piezoelectric element and method of manufacturing the same
AssigneeToshiba Storage Device Corporation
InventorsShigeyoshi UMEMIYA, Tsuyoshi AOKI
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Abstract
According to one embodiment, a piezoelectric element is provided by forming a first electrode film on a major surface of a substrate, forming a modified film by modifying at least a portion of the major surface of the substrate by heating the substrate in an ambient containing oxygen, and forming a piezoelectric film by depositing a piezoelectric material on the first electrode film, forming a second electrode film on the piezoelectric film, adhering a support on the second electrode film, and peeling off a multilayered structure including at least the first electrode film, the piezoelectric film, the second electrode film, and the support from the substrate.
Claims11
A method of manufacturing a piezoelectric element, comprising:
- forming a first electrode film on a surface of a substrate;
- forming a modified film by modifying at least a portion of the surface of the substrate by heating the substrate in an ambient containing oxygen, and forming a piezoelectric film by depositing a piezoelectric material on the first electrode film;
- forming a second electrode film on the piezoelectric film;
- attaching a support to the second electrode film;
- and
- removing a multilayered structure from the substrate, the multilayered structure comprising the first electrode film, the piezoelectric film, the second electrode film, and the support.
A piezoelectric element comprising:
- a support;
- a first electrode film on a surface of the support;
- a piezoelectric film on the first electrode film;
- a second electrode film on the piezoelectric film;
- and
- a modified layer on the second electrode film, the modified layer comprising a reaction product of AlTiC and oxygen.
A method of manufacturing a head gimbal assembly comprising a load beam, a flexure which is connected to a distal portion of the load beam and supports a slider, and a piezoelectric element mounted on the flexure, comprising:
- forming a first electrode film on a surface of a substrate;
- forming a modified layer by modifying at least a portion of the surface of the substrate by heating the substrate in an ambient containing oxygen, and forming a piezoelectric film by depositing a piezoelectric material on the first electrode film;
- forming a second electrode film on the piezoelectric film;
- attaching the flexure to the second electrode film;
- removing a multilayered structure from the substrate, the multilayered structure comprising the first electrode film, the piezoelectric film, the second electrode film, and the flexure;
- attaching the slider to the flexure;
- and
- connecting the flexure to the load beam.
Dependencies are inferred from the claim text.