Molding apparatus
AssigneeFujitsu Limited
InventorShusaku NISHIYAMA
Life of this patent
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Abstract
A molding apparatus includes two metal molds arranged at positions opposing to each other and each having a die for molding a member into a desired shape, a heating unit for heating the member, an ultrasonic wave transmitting and receiving unit arranged on the metal mold for irradiating the member with an ultrasonic wave and receiving the reflected ultrasonic wave, a drive unit for driving at least one of the metal molds and a control unit for detecting a partial contact of the member with respect to the metal mold using wave readings from the ultrasonic wave transmitting and receiving unit and controlling the drive unit to adjust a pressing velocity of the metal mold.
Claims10
A molding apparatus comprising:
- two metal molds arranged at positions opposed to each other and each having a die for molding a member into a desired shape;
- a heating unit for heating the member;
- an ultrasonic wave transmitting and receiving unit arranged on the metal mold, for irradiating the member with an ultrasonic wave and receiving the reflected ultrasonic wave;
- a drive unit for driving at least one of the metal molds;
- and
- a control unit for detecting a partial contact of the member with respect to the metal mold using wave readings from the ultrasonic wave transmitting and receiving unit and for controlling the drive unit to adjust a pressing velocity of the metal mold.
A molding method comprising:
- arranging a member between two metal molds arranged at positions opposed to each other;
- heating the member;
- bringing the metal molds toward each other at a first velocity;
- detecting a partial contact of the metal mold and the member using an ultrasonic wave transmitting and receiving unit provided on one of the metal molds;
- and
- controlling the velocity of movement of the metal mold to a second velocity which is different from the first velocity.
Dependencies are inferred from the claim text.