Method of joining electronic component and the electronic component

An electronic component obtained such that bonding resin containing conductive particles is disposed between a substrate and the component, the bonding resin retained in a gap between first electrodes of the substrate and second electrodes of the component is heated and flows to cause the conductive particles melted between the first electrodes and the second electrodes to self-assemble, and then the substrate and the component are cooled to a temperature not higher than a solidification temperature of the conductive particles to mount the component on the substrate,

• wherein dummy electrodes are formed on wiring connected to the first electrodes of the substrate, outside a junction region containing all of the first electrodes and the second electrodes and in the bonding resin, the dummy electrodes not being involved in electrical connection between the substrate and the component.

An electronic component obtained such that bonding resin containing conductive particles is disposed between a substrate and the component, the bonding resin retained in a gap between first electrodes of the substrate and second electrodes of the component is heated and flows to cause the conductive particles melted between the first electrodes and the second electrodes to self-assemble, and then the substrate and the component are cooled to a temperature not higher than a solidification temperature of the conductive particles to mount the component on the substrate,

• wherein first dummy electrodes adjacent to the first electrodes and second dummy electrodes adjacent to the first dummy electrodes at shorter intervals than the first electrodes are formed on wiring connected to the first electrodes of the substrate, outside a junction region containing all of the first electrodes and the second electrodes and in the bonding resin, the first and second dummy electrodes being formed as dummy electrodes not being involved in electrical connection between the substrate and the component.

An electronic component obtained such that bonding resin containing conductive particles is disposed between a substrate and the component, the bonding resin retained in a gap between first electrodes of the substrate and second electrodes of the component is heated and flows to cause the conductive particles melted between the first electrodes and the second electrodes to self-assemble, and then the substrate and the component are cooled to a temperature not higher than a solidification temperature of the conductive particles to mount the component on the substrate,

• wherein dummy electrodes are formed on wiring connected to the second electrodes of the component, outside a junction region containing all of the first electrodes and the second electrodes and in the bonding resin, the dummy electrodes not being involved in electrical connection between the substrate and the component.

An electronic component obtained such that bonding resin containing conductive particles is disposed between a substrate and the component, the bonding resin retained in a gap between first electrodes of the substrate and second electrodes of the component is heated and flows to cause the conductive particles melted between the first electrodes and the second electrodes to self-assemble, and then the substrate and the component are cooled to a temperature not higher than a solidification temperature of the conductive particles to mount the component on the substrate,

• wherein first dummy electrodes adjacent to the second electrodes and second dummy electrodes adjacent to the first dummy electrodes at shorter intervals than the second electrodes are formed on the component, outside a junction region containing all of the first electrodes and the second electrodes and in the bonding resin, the first and second dummy electrodes being formed as dummy electrodes not being involved in electrical connection between the substrate and the component.